Elektromagnetische Modellbildung und Optimierung von Silizium-Durchkontaktierungen

Publikationen

• Duan, Xiaomin; Dahl, David; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian: A Rigorous Approach for the Modeling of Through-Silicon-Via Pairs Using Multipole Expansions. IEEE Transactions on Components, 6(1), Januar 2016.
• Dahl,David; Beyreuther, Anne; Duan, Xiaomin; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian, Hrsg.: Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method, Mai 2014.IEEE Workshop on Signal and Power Integrity (SPI), Ghent, Belgium.
• Dahl, David; Duan, Xiaomin; Beyreuther, Anne; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian, Hrsg.: Application of the Transverse Resonance Method for Efficient Extraction of the Dispersion Relation of Arbitrary Layers in Silicon Interposers, Mai 2013.IEEE Workshop on Signal and Power Integrity (SPI), Paris, France.
• Dahl, David; Duan, Xiaomin; Beyreuther, Anne; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian, Hrsg.: Applying a physics-based via model for the simulation of Through Silicon Vias, Oktober 2013.IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA.
• Dahl, David; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian: Effect of 3D Stack-Up Integration on Through Silicon Via Characteristics. IEEE Workshop on Signal and Power Integrity (SPI), Italy, Mai 2017.
• Dahl, David; Müller, Sebastian; Schuster, Christian, Hrsg.: Effect of Layered Media on the Parallel Plate Impedance of Printed Circuit Boards , Dezember 2014.IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, India, Bangalore.
• Duan, Xiaomin; Dahl, David; Schuster, Christian; Ndip, Ivan; Lang, Klaus-Dieter, Hrsg.: Efficient Analysis of Wave Propagation for Through-Silicon-Via Pairs using Multipole Expansion Method, Mai 2015.IEEE Workshop on Signal and Power Integrity (SPI), Berlin.
• Hardock, Andreas; Dahl, David; Brüns, Heinz-D.; Schuster, Christian, Hrsg.: Efficient Calculation of External Fringing Capacitances for Physics-Based PCB Modeling, Mai 2015.IEEE Workshop on Signal and Power Integrity (SPI), Berlin.
• Dahl, David; Reuschel, Torsten; Preibisch, Jan Birger; Duan, Xiaomin; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian: Efficient Total Crosstalk Analysis of Large Via Arrays in Sillicon Interposers. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6(12), Dezember 2016.
• Duan, Xiaomin; Boettcher, Mathias; Dahl, David; Schuster, Christian; Tschoban, Christian; Ndip, Ivan; Lang, Klaus-Dieter, Hrsg.: High Frequency Characterization of Silicon Substrate and through Silicon Vias, Juni 2016.Electronic Components and Technology Conference (ECTC).
• Reuschel, Torsten; Kotzev, Miroslav; Dahl, David; Schuster, Christian , Hrsg.: Modeling of Differential Striplines in Segmented Simulation of Printed Ciruit Board Links, July 2016.IEEE Signal and Power Integrity Conference (SIPI 2016), Ottawa, ON, Canada.
• Dahl, David; Reuschel, Torsten; Duan, Xiaomin; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian, Hrsg.: On the Upper Bound of Total Uncorrelated Crosstalk in Large Through Silicon Via Arrays, May 2016.IEEE Workshop on Signal and Power Integrity (SPI), Turin, Italy.
• Dahl, David: Electromagnetic Modeling and Optimization of Through Silicon Vias. Promotion/Dissertation, TUHH, Dezember 2017.