MiMoSe - Microelectronic Modular System for Sensor-Integrating Machine Elements
The integration of sensors turns them into cyber-physical systems. In programme 2305, the focus is on the direct integration of sensor systems into the existing mechanical structure of conventional machine elements such as screws, gears and bearings. The systematic development of these sensor-integrating machine elements (SiME), in particular taking into account the severely limited installation space, efficient data management and a self-sufficient energy management, represents a significant challenge. The necessary interdisciplinary collaboration between the fields of mechanics, (micro-) electronics and software requires an early, coordinated approach to bring together the respective development domains, which must be supported in the form of new approaches and methods. Consequently, the aim of the project is to methodically support the interdisciplinary, systematic development of SiME. This is being researched in a network of methodical product development (PKT), machine elements (pmd) and microelectronics (mst) using the example of fastening and movement screws (see Figure 1).
Figure 1: Integration of modular sensor systems into existing machine elements
The overall objective of the project is to design a microelectronic modular system for sensor systems in SiME. Using the example of sensor-integrating fastening and movement screws, the model-based modular system will be tested and the functional verification of the configured sensor systems will be provided. In addition, the development of the necessary methods for the configuration and predesign of SiME will be carried out. With the integration of sensor systems in standardised machine elements, a wide variety of process-relevant measurement tasks can be fulfilled by recording and evaluating data in situ and transmitting it to the higher-level system. Using the screw as an exemplary machine element, suitable sensor systems are to be generated within the framework of this project with the help of the model-based modular system on the basis of different strategies, as well as prototypically realised, integrated and finally experimentally examined.
The modularisation of microelectronic sensor systems is to be supported by Model Based Systems Engineering (MBSE). In the first step, the requirements regarding the application and environmental conditions are determined. Subsequently, future product characteristics can be derived. By linking appropriate and compatible components, a mechatronic product architecture is created. In the modelling language SysML, properties and components can be linked in dependency diagrams and corresponding module variants can be modelled. The basic strategies defined for the configuration of the sensor systems are the installation space-, energy- and data-optimised strategy. For this, the necessary parameters are determined and stored with corresponding calculation rules. Based on the utilisation requirements and the selection of suitable module variants, functional sensor systems are generated and predefined. The configuration system is tested on the example of screws. In a performance analysis, the solution alternatives are evaluated with regard to their degree of fulfilment of the requirements and then an energy-optimised, a data-optimised and an installation-space-optimised solution is selected. One sensor system is selected for prototypical implementation and is then realised and put into operation in the form of a demonstrator. In the last step, the resulting SiME can be validated experimentally.
Principal Investigator: Prof. Dr.-Ing Dieter Krause
Co-Investigator: Jan Küchenhof, M.Sc.
Funding and Partners
The project is funded by the German Research Foundation (DFG) within the scope of SPP 2305. The project will run from 2022 to 2024.