Initial situation
MiMoSe II is the follow-up project to MiMoSe and focuses on research into sensor-integrating machine elements. As part of the Priority Programme 2305, it concentrates on the direct integration of sensor systems into the mechanical structure of conventional machine elements such as screws, gears, or bearings. This approach transforms conventional machine elements into sensor-integrating machine elements (SiME), turning them into cyber-physical systems and promising pioneers of digitalisation.
The systematic development of SiME poses significant challenges, particularly regarding the limited installation space, efficient data management, and self-sufficient energy consumption. The necessary interdisciplinary collaboration between the fields of mechanics, (micro)electronics, and software requires an early, coordinated approach across the different development domains. This will be supported by a microelectronic modular system for sensor-integrating machine elements (MiMoSe). Following the development and implementation of modular, system-based models in the first funding period of the "MiMoSe" project, the follow-up project "MiMoSe II" now aims to address open research questions and expand the functionality of the modular system. New aspects include energy self-sufficiency, wireless communication, update capability, and support in selecting testing methods. The methodology is developed using the example of sensor-integrating screws (see Figure 1) and utilizes the expertise of an interdisciplinary team. The joint effort involves methodical product development (PKT - TU Hamburg), machine elements (pmd - TU Darmstadt) and microelectronics (MST - TU Hamburg).
Project Objectives
In summary, the main objective of the MiMoSe research project is to support engineers in the development of sensor-integrating machine elements through a methodology. To this end, the microelectronic modular system developed in the predecessor project will be expanded, with a particular focus on the aspects of self-sufficiency and testing procedures. Sensor-integrating screws will continue to serve as an application example, and other machine elements will be added to the modular system as the project progresses. As a final step and proof of concept for the project, suitable sensor systems will be generated using a configurator based on the modular system. A prototype will be manufactured and experimentally tested.
Solution Approach
The modularisation of microelectronic sensor systems is supported by Model Based Systems Engineering (MBSE). The first step is to determine the requirements in terms of operating and environmental conditions. Future product characteristics can then be derived. A mechatronic product architecture is created by linking conditions of suitable and compatible components. In the SysML modelling language, properties and components can be linked in dependency diagrams and corresponding module variants can be presented. The three strategies for configuring sensor systems are optimising the installation space, energy consumption and data generation. The necessary parameters are determined for this purpose and stored with corresponding calculation rules. Based on the usage requirements and selecting suitable module variants, functional sensor systems are generated and designed. The configuration system is tested using the example of screws. In a performance analysis, the alternative solutions are evaluated in terms of their degree of fulfilment of the requirements, and then an energy-optimised, a data-optimised and an installation space-optimised solution are selected. A sensor system is selected for prototypical implementation and implemented in the form of a demonstrator and put into operation. In the final step, the resulting SiME can be validated experimentally.
Project Organisation
Principal Investigator: Prof. Dr.-Ing Dieter Krause
Co-Investigator : Matthias Hüls, M. Sc.
Funding
The project is funded by the German Research Foundation (DFG) as part of the SPP 2305.
The project runs from 2025 to 2027.