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IEET > Staff > Research Assistants > Marwan Mostafa, M.Sc.

Marwan Mostafa

M.Sc.
Research Assistant

Contact

Marwan Mostafa, M.Sc.
E-6 Elektrische Energietechnik
  • Elektrische Energietechnik
Office Hours
nach Vereinbarung/ by appointment
Harburger Schloßstraße 36,
21079 Hamburg
Building HS36, Room C3 0.013
Phone: +49 40 42878 4097
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Research Project

iNeP
Integrated network planning for the electricity, gas and heat sectors

iNeP

Integrated network planning for the electricity, gas and heat sectors

Federal Ministry for Economic Affairs and Climate Action (BMWK); Duration: 2021 to 2026

to the project page

Publications

TUHH Open Research (TORE)

2023

2022

2021

Courses

Stud.IP
zur Veranstaltung in Stud.IP Studip_icon
Microsystems Technology
Untertitel:
Module: Microsystems Technology in Theory and Practice
Semester:
WiSe 22/23
Veranstaltungstyp:
PBL -Projekt-/problembasierte Lehrveranstaltung (Lehre)
Veranstaltungsnummer:
lv725_w22
DozentIn:
Prof. Dr. Hoc Khiem Trieu
Beschreibung:
  • Introduction (historical view, scientific and economic relevance, scaling laws)
  • Semiconductor Technology Basics, Lithography (wafer fabrication, photolithography, improving resolution, next-generation lithography, nano-imprinting, molecular imprinting)
  • Deposition Techniques (thermal oxidation, epitaxy, electroplating, PVD techniques: evaporation and sputtering; CVD techniques: APCVD, LPCVD, PECVD and LECVD; screen printing)
  • Etching and Bulk Micromachining (definitions, wet chemical etching, isotropic etch with HNA, electrochemical etching, anisotropic etching with KOH/TMAH: theory, corner undercutting, measures for compensation and etch-stop techniques; plasma processes, dry etching: back sputtering, plasma etching, RIE, Bosch process, cryo process, XeF2 etching)
  • Surface Micromachining and alternative Techniques (sacrificial etching, film stress, stiction: theory and counter measures; Origami microstructures, Epi-Poly, porous silicon, SOI, SCREAM process, LIGA, SU8, rapid prototyping)
  • Thermal and Radiation Sensors (temperature measurement, self-generating sensors: Seebeck effect and thermopile; modulating sensors: thermo resistor, Pt-100, spreading resistance sensor, pn junction, NTC and PTC; thermal anemometer, mass flow sensor, photometry, radiometry, IR sensor: thermopile and bolometer)
  • Mechanical Sensors (strain based and stress based principle, capacitive readout, piezoresistivity,  pressure sensor: piezoresistive, capacitive and fabrication process; accelerometer: piezoresistive, piezoelectric and capacitive; angular rate sensor: operating principle and fabrication process)
  • Magnetic Sensors (galvanomagnetic sensors: spinning current Hall sensor and magneto-transistor; magnetoresistive sensors: magneto resistance, AMR and GMR, fluxgate magnetometer)
  • Chemical and Bio Sensors (thermal gas sensors: pellistor and thermal conductivity sensor; metal oxide semiconductor gas sensor, organic semiconductor gas sensor, Lambda probe, MOSFET gas sensor, pH-FET, SAW sensor, principle of biosensor, Clark electrode, enzyme electrode, DNA chip)
  • Micro Actuators, Microfluidics and TAS (drives: thermal, electrostatic, piezo electric and electromagnetic; light modulators, DMD, adaptive optics, microscanner, microvalves: passive and active, micropumps, valveless micropump, electrokinetic micropumps, micromixer, filter, inkjet printhead, microdispenser, microfluidic switching elements, microreactor, lab-on-a-chip, microanalytics)
  • MEMS in medical Engineering (wireless energy and data transmission, smart pill, implantable drug delivery system, stimulators: microelectrodes, cochlear and retinal implant; implantable pressure sensors, intelligent osteosynthesis, implant for spinal cord regeneration)
  • Design, Simulation, Test (development and design flows, bottom-up approach, top-down approach, testability, modelling: multiphysics, FEM and equivalent circuit simulation; reliability test, physics-of-failure, Arrhenius equation, bath-tub relationship)
  • System Integration (monolithic and hybrid integration, assembly and packaging, dicing, electrical contact: wire bonding, TAB and flip chip bonding; packages, chip-on-board, wafer-level-package, 3D integration, wafer bonding: anodic bonding and silicon fusion bonding; micro electroplating, 3D-MID)
Voraussetzungen:
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Leistungsnachweis:
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Sonstiges:
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ECTS-Kreditpunkte:
2
Weitere Informationen aus Stud.IP zu dieser Veranstaltung
Heimatinstitut: Institut für Mikrosystemtechnik (E-7)
In Stud.IP angemeldete Teilnehmer: 1

Supervised Theses

ongoing
completed

2022

  • Barthelme, J. (2022). Technisch-ökonomische Systemmodellierung und -anlayse eines urbanen Quatiers hinsichtlich des Einsatz von Wasserstoff als primärer Energieträger.

TU Hamburg
Institute of Electrical Power and Energy Technology (ieet) E-6
Prof. Dr.-Ing. Christian Becker
Harburger Schloßstraße 36
21079 Hamburg
E-mail : ieet(at)tuhh.de
Phone : +49 40 42878 3213
Fax : +49 40 42878 2382
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