Overview Devices and Methods (Persons in charge)

This page gives an overview of the devices and methods of the BeEM with the names of the persons in charge for the particular device.

For more information, see the individual sub-pages in the menu on the left. I

f you have any questions, please do not hesitate to contact the person responsible for the respective device.

1. Scanning Electron Microscopes (SEM)

In the Scanning Electron Microscopy (SEM, also called scanning electron microscope), the sample surface is scanned with a finely focused electron beam in a grid. Secondary electrons (SE) and backscattered electrons (BSE) are generated in each grid point.

The SE and BSE can be detected with different types of detectors, which makes it possible to obtain indirect images of the sample surface simultaneously with the scanning.

Our Scanning Electron Microscopes:

  • Zeiss Supra 55 VP FEG-SEM with Variable Pressure Mode (VP-Mode), EDS, WDS und EBSD
    (Building H, Room -1.24D , Person in Charge: Jens Timmermann, Tel.: -4575, Substitute: Farhad Riazi, Tel.:-4573)
  • Leo Gemini 1530 FEG-SEM with EDS
    (Building M, Room 3526, Phone: 2320, Person in Charge: Farhad Riazi, Phone: -4573, Substitute: Jens Timmermann  Phone: 4575,)

2. Transmission electron microscopes (TEM)

In the Transmission Mlectron microscopy (TEM, also Transmission Electron Microscope), the samples are irradiated by the electron beam (transmission). This enables direct imaging of the sample structure. The samples must be sufficiently thin, which requires special sample preparation.

Very high resolutions can be achieved with the TEM. The crystal structure can also be determined by elastic diffraction of the electrons at crystalline sample areas.

Our Talos F200X also offers a variety of other examination options. Please, see the menu on the left for more information.

3. Focussed Ion Beam (FIB)

4. Analytical Methods

In addition to the pure image generation (imaging process), electron microscopes can also be used for answering various analytical questions due to the different interaction processes of the electron beam with the sample material. Due to the formation of characteristic X-rays in the sample, for example, it is possible to determine the elemental composition of a sample (EDX and WDX). Whereas due to the diffraction of the electron beam on crystalline structures, the crystal structure and orientation can be determined (diffraction in TEM and EBSD at the SEM). The combination of different methods can also be used in connection with modern computer programs to generate 3D models of the sample structure or even individual sample phases.

4.1  EDS (Energy Dispersive X-ray Spectroscopy)

Available on all our electron microscopes. If you have any questions, please contact the person responsible for the particular device:

  • Zeiss Supra 55 VP FEG-SEM with Variable Pressure Mode (VP-Mode), EDS, WDS und EBSD
    (Building H, Room -1.24D , Person in Charge: Jens Timmermann, Tel.: -4575, Substitute: Farhad Riazi, Tel.:-4573)
  • Leo Gemini 1530 FEG-SEM with EDS
    (Building M, Room 3526, Phone: 2320, Person in Charge: Farhad Riazi, Phone: -4573, Substitute: Jens Timmermann  Phone: 4575,)

4.2  WDS (Wave Dispersive X-ray Spectroscopy)

WDS is only available on the Zeiss Supra 55 VP. If you have any questions, please contact the person responsible for the device:

  • Zeiss Supra 55 VP FEG-SEM with Variable Pressure Mode (VP-Mode), EDS, WDS und EBSD
    (Building H, Room -1.24D , Person in Charge: Jens Timmermann, Tel.: -4575, Substitute: Farhad Riazi, Tel.:-4573)

4.3  TEM Diffraction and TEM 3D Tomography

4.4  3D examinations and 3D reconstruction at the FIB

5. Optical Microscopes

  • Leica EZ4 HD stereo microscope
    (Building M, Room 2556, Contact: Lida Wang, Tel.: -4574)
  • Olympus SZ 30
    (Building M, Room 2556, Contact: Lida Wang, Tel.: -4574)

6. Sample Preparation

  • Leica EM RES102 The unique ion beam milling system combines the preparation of TEM, SEM and LM samples in one single benchtop unit, Contact: 1. Farhad Riazi, Tel.: - 4573, 2. Tobias Krekeler, Tel.: -4667.
  • Leica EM TXP
    (Building M, Room 2556, Contact: Lida Wang, Tel.: -4574)
  • Sputter Coater SCD 050 by Baltec
    (Building M, Room 3526, Contact: Farhad Riazi, Tel.: -4753)
  • Critical Point Dryer CPD 7501 by Polaron
    (Building M, Room 2549, Contact: Jens Timmermann, Tel.: -4575)
  • Struers TenuPol-3
    (Building M, Room 2549, Contact: Lida Wang, Tel.: -4574)
  • Diener Plasma Cleaner
    (Building M, Room 3526, Contact: Farhad Riazi, Tel.: -4753)