14.04.2026

Accepted Presentation at the Central and Eastern European Ultrasonics Symposium (CEEUS)

We are pleased to announce that our joint work with Technische Universitรคt Darmstadtยดs Integrated Electronic Systems Lab has been accepted for presentation at the ๐—–๐—ฒ๐—ป๐˜๐—ฟ๐—ฎ๐—น ๐—ฎ๐—ป๐—ฑ ๐—˜๐—ฎ๐˜€๐˜๐—ฒ๐—ฟ๐—ป ๐—˜๐˜‚๐—ฟ๐—ผ๐—ฝ๐—ฒ๐—ฎ๐—ป ๐—จ๐—น๐˜๐—ฟ๐—ฎ๐˜€๐—ผ๐—ป๐—ถ๐—ฐ๐˜€ ๐—ฆ๐˜†๐—บ๐—ฝ๐—ผ๐˜€๐—ถ๐˜‚๐—บ (๐—–๐—˜๐—˜๐—จ๐—ฆ).

In this research, we integrated our ultrasonic through-metal backscatter communication system into a standard M20 bolt, enabling the wireless readout of sensor data from within the metal structure.
๐—ง๐—ต๐—ถ๐˜€ ๐—ฑ๐—ฒ๐—บ๐—ผ๐—ป๐˜€๐˜๐—ฟ๐—ฎ๐˜๐—ฒ๐˜€, ๐—ณ๐—ผ๐—ฟ ๐˜๐—ต๐—ฒ ๐—ณ๐—ถ๐—ฟ๐˜€๐˜ ๐˜๐—ถ๐—บ๐—ฒ, ๐—ฟ๐—ฒ๐—น๐—ถ๐—ฎ๐—ฏ๐—น๐—ฒ ๐˜‚๐—น๐˜๐—ฟ๐—ฎ๐˜€๐—ผ๐—ป๐—ถ๐—ฐ ๐—ฑ๐—ฎ๐˜๐—ฎ ๐˜๐—ฟ๐—ฎ๐—ป๐˜€๐—บ๐—ถ๐˜€๐˜€๐—ถ๐—ผ๐—ป ๐˜๐—ต๐—ฟ๐—ผ๐˜‚๐—ด๐—ต ๐˜๐—ต๐—ฒ ๐—ฐ๐—ผ๐—บ๐—ฝ๐—น๐—ฒ๐˜… ๐—ด๐—ฒ๐—ผ๐—บ๐—ฒ๐˜๐—ฟ๐˜† ๐—ผ๐—ณ ๐—ฎ ๐—ฟ๐—ฒ๐—ฎ๐—น ๐—บ๐—ฎ๐—ฐ๐—ต๐—ถ๐—ป๐—ฒ ๐—ฒ๐—น๐—ฒ๐—บ๐—ฒ๐—ป๐˜.

Our approach opens up new possibilities for retrofitting existing machinery with smart, ultra-low-power sensors embedded directly into standardized components. Such sensor-integrating machine elements could enable continuous condition monitoring with minimal installation effort and without the need for radio-frequency based wireless communication, which is often severely limited in metallic environments.
 

Photo
(1) Backscatter-Reader
(2) Piezo-Transducer
(3) Backscatter-Tag
(4) Screw with integrated Piezo-Transducer