Hermetically sealed protective layers for mechanically flexible neuroimplants

Neuroimplants are tenchnical systems, which connect to nerve cells in order to query necessary information and restore body functions. Since they usually consist of a flexible carrier film (with the necessary electronics), they require a mechanically flexible and hermetically sealed protective layer. So far, such an encapsulation layer, which would prove to be stable in the human body over a long period of time, could not be realized.

The aim of this project is to develop a hermetically sealed encapsulation of mechanically flexible neuroimplants with a lifespan of at least 20 years. FEM simulations are also to be used to investigate possible failure mechanisms in order to optimize the choice of encapsulation techniques and materials.

Funding:

This project is a cooperation between the TU Hamburg (MST) and the University of Bremen (IMSAS) and is funded by the DFG.

Contact:

Konstanze Schober, Schabnam Noghabai

Figure 1. Microfabricated neuroimplant (5 mm long, 30 μm thick and 130 μm wide) with an SMD omnetics connector and a 25 mm long flexible cable with a 160 μm2 microelectrode at the end of the cable to contact the brain cells.