As part of the Interdisciplinary Weeks (IDW), the Kiel University of Applied Sciences and the Hamburg University of Technology held a joint course that covers the entire value chain of modern power electronics: from chip design to power module design and system design. The aim was to provide students with a comprehensive insight into methods, tools and manufacturing steps that are necessary for energy-efficient, robust and sustainable power electronics.
After basic introductions to the topic of power electronics, the participants developed scalable semiconductor devices based on gallium nitride. Based on this, they designed power modules with a focus on thermal management, reliability and production processes. The final step was the system level: from drive and charging converters to renewable energy systems, topologies were evaluated and systems and circuits were simulated.
The coupling of component, module and system design in a compact teaching format is unique – it prepares students for industry-oriented development processes in a practical way. Wide-bandgap technologies in particular show that decisions at the chip level have a direct impact on the module and the application – and vice versa.
Content and methods at a glance
- Chip design: Design criteria for modern power semiconductors (e.g. blocking voltage, on-resistance), layout principles and process steps of manufacturing, modeling of device physics.
- Power module design: packaging and connection technology, substrate concepts, cooling, material selection, reliability aspects.
- System design: Current power electronic topologies for motor controls and e-charging stations, gate control.
Added value for students and the region
The course strengthens the practice-oriented exchange between universities and industrial partners in northern Germany. Students benefit from the combined expertise of both application-oriented universities and acquire skills that are directly in demand in development departments of energy, mobility and industrial applications.
Outlook
Due to the positive response, it is planned to make the format permanent in future IDW issues.
Participating Chairs
TUHH – Power Electronic Devices
The Institute for Power Electronic Devices conducts research in the field of active power semiconductor components. In addition, intelligent components for integrated fault prediction and neuromorphic electronics are being developed. The resulting devices and technologies are based on wide bandgap semiconductors as well as silicon and address applications in electromobility, renewable energies and autonomous industrial environments.
HAW Kiel – Packaging and Connection Technologies (AVT) in Mechatronics
The Institute of Mechatronics researches the packaging and connection technology of power electronic components, the use of special materials, thermal management and strategies for increasing efficiency and extending the service life of power modules. A special focus is on the application of novel semiconductor technologies such as silicon carbide (SiC) and gallium nitride (GaN).
HAW Kiel – Power Electronics and Drives
The aim of the activities in the Power Electronics and Drives working group is to use the latest technologies to increase the efficiency of the converter systems, reduce the size and minimize the costs. This is achieved through the use of modern circuit topologies, FEM simulations as well as the use of new wide-bandgap materials. Everything is covered, from circuit development to complete system development.
Contact
Press and Public Relations at HAW Kiel
E-Mail: presse(at)haw-kiel.de
Public Relations and Marketing of the TUHH
E-mail: pressestelle(at)tuhh.de
