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Institut für Elektrische Energietechnik
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Institut für Elektrische Energietechnik
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IEET > Personal > Wissenschaftliche Mitarbeitende > Marwan Mostafa, M.Sc.

Marwan Mostafa

M.Sc.
Wissenschaftlicher Mitarbeiter

Kontakt

Marwan Mostafa, M.Sc.
E-6 Elektrische Energietechnik
  • Elektrische Energietechnik
Sprechzeiten
nach Vereinbarung/ by appointment
Harburger Schloßstraße 36,
21079 Hamburg
Gebäude HS36, Raum C3 0.013
Tel: +49 40 42878 4097
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Forschungsprojekt

iNeP
Integrierte Netzplanung der Sektoren Strom, Gas und Wärme

iNeP

Integrierte Netzplanung der Sektoren Strom, Gas und Wärme

Bundesministerium für Wirtschaft und Klimaschutz (BMWK); Laufzeit: 2021 bis 2026

zur Projektseite

Publikationen

TUHH Open Research (TORE)

2023

2022

2021

Lehrveranstaltungen

Stud.IP
zur Veranstaltung in Stud.IP Studip_icon
Microsystems Technology
Untertitel:
Module: Microsystems Technology in Theory and Practice
Semester:
WiSe 22/23
Veranstaltungstyp:
PBL -Projekt-/problembasierte Lehrveranstaltung (Lehre)
Veranstaltungsnummer:
lv725_w22
DozentIn:
Prof. Dr. Hoc Khiem Trieu
Beschreibung:
  • Introduction (historical view, scientific and economic relevance, scaling laws)
  • Semiconductor Technology Basics, Lithography (wafer fabrication, photolithography, improving resolution, next-generation lithography, nano-imprinting, molecular imprinting)
  • Deposition Techniques (thermal oxidation, epitaxy, electroplating, PVD techniques: evaporation and sputtering; CVD techniques: APCVD, LPCVD, PECVD and LECVD; screen printing)
  • Etching and Bulk Micromachining (definitions, wet chemical etching, isotropic etch with HNA, electrochemical etching, anisotropic etching with KOH/TMAH: theory, corner undercutting, measures for compensation and etch-stop techniques; plasma processes, dry etching: back sputtering, plasma etching, RIE, Bosch process, cryo process, XeF2 etching)
  • Surface Micromachining and alternative Techniques (sacrificial etching, film stress, stiction: theory and counter measures; Origami microstructures, Epi-Poly, porous silicon, SOI, SCREAM process, LIGA, SU8, rapid prototyping)
  • Thermal and Radiation Sensors (temperature measurement, self-generating sensors: Seebeck effect and thermopile; modulating sensors: thermo resistor, Pt-100, spreading resistance sensor, pn junction, NTC and PTC; thermal anemometer, mass flow sensor, photometry, radiometry, IR sensor: thermopile and bolometer)
  • Mechanical Sensors (strain based and stress based principle, capacitive readout, piezoresistivity,  pressure sensor: piezoresistive, capacitive and fabrication process; accelerometer: piezoresistive, piezoelectric and capacitive; angular rate sensor: operating principle and fabrication process)
  • Magnetic Sensors (galvanomagnetic sensors: spinning current Hall sensor and magneto-transistor; magnetoresistive sensors: magneto resistance, AMR and GMR, fluxgate magnetometer)
  • Chemical and Bio Sensors (thermal gas sensors: pellistor and thermal conductivity sensor; metal oxide semiconductor gas sensor, organic semiconductor gas sensor, Lambda probe, MOSFET gas sensor, pH-FET, SAW sensor, principle of biosensor, Clark electrode, enzyme electrode, DNA chip)
  • Micro Actuators, Microfluidics and TAS (drives: thermal, electrostatic, piezo electric and electromagnetic; light modulators, DMD, adaptive optics, microscanner, microvalves: passive and active, micropumps, valveless micropump, electrokinetic micropumps, micromixer, filter, inkjet printhead, microdispenser, microfluidic switching elements, microreactor, lab-on-a-chip, microanalytics)
  • MEMS in medical Engineering (wireless energy and data transmission, smart pill, implantable drug delivery system, stimulators: microelectrodes, cochlear and retinal implant; implantable pressure sensors, intelligent osteosynthesis, implant for spinal cord regeneration)
  • Design, Simulation, Test (development and design flows, bottom-up approach, top-down approach, testability, modelling: multiphysics, FEM and equivalent circuit simulation; reliability test, physics-of-failure, Arrhenius equation, bath-tub relationship)
  • System Integration (monolithic and hybrid integration, assembly and packaging, dicing, electrical contact: wire bonding, TAB and flip chip bonding; packages, chip-on-board, wafer-level-package, 3D integration, wafer bonding: anodic bonding and silicon fusion bonding; micro electroplating, 3D-MID)
Voraussetzungen:
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Leistungsnachweis:
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Sonstiges:
font-size:9pt
ECTS-Kreditpunkte:
2
Weitere Informationen aus Stud.IP zu dieser Veranstaltung
Heimatinstitut: Institut für Mikrosystemtechnik (E-7)
In Stud.IP angemeldete Teilnehmer: 1

Betreute Abschlussarbeiten

laufende
beendete

2022

  • Barthelme, J. (2022). Technisch-ökonomische Systemmodellierung und -anlayse eines urbanen Quatiers hinsichtlich des Einsatz von Wasserstoff als primärer Energieträger.

TU Hamburg
Institut für Elektrische Energietechnik (ieet) E-6
Prof. Dr.-Ing. Christian Becker
Harburger Schloßstraße 36
21079 Hamburg
E-Mail : ieet(at)tuhh.de
Tel : +49 40 42878 3213
Fax : +49 40 42878 2382
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